Litcius/Paper detail

Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture

Zihan Zhou, Yunwen Wu, Huiqin Ling, Jie Guo, Su Wang, Ming Li

2022Journal of Industrial and Engineering Chemistry13 citationsDOI

Topics & Concepts

Etching (microfabrication)Layer (electronics)WaferMaterials scienceOxideChemical engineeringSilicon oxideSiliconTernary operationNanotechnologyOptoelectronicsMetallurgyComputer scienceSilicon nitrideEngineeringProgramming languageCatalytic Processes in Materials ScienceAdvanced Data Storage TechnologiesPhotonic Crystals and Applications
Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture | Litcius