Litcius/Paper detail

Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments

John Bell, Laura Redmond, Kalind Carpenter, Jean-Pierre de la Croix

2022Journal of Microelectronics and Electronic Packaging11 citationsDOIOpen Access PDF

Abstract

ABSTRACT Rigid-flex circuit boards are becoming more prevalent as the limits are pushed on the size, mass, and geometry of electronic systems. A key aspect of designing a rigid-flex printed circuit boards (PCB) system is an assessment of the dynamic properties of the PCB and predicting system performance under dynamic loading. Among current modeling methodologies for rigid-flex PCB, a simplified modeling methodology that adequately captures the system dynamics does not exist. This article presents a novel, computationally efficient approach for modeling rigid-flex PCB systems and the calibration of the material models via modal testing. The resulting simplified model is able to capture system frequencies, mode shapes, and representative force-displacement behavior. The proposed methodology is used to model NASA Jet Propulsion Laboratory’s Pop-Up Flat Folding Explorer Robot (PUFFER) and assess the sensitivity of a system model to input parameters.

Topics & Concepts

FLEXFinite element methodEngineeringDisplacement (psychology)Mechanical engineeringSensitivity (control systems)Modal analysisModalPropulsionStructural engineeringElectronic engineeringAerospace engineeringPolymer chemistryTelecommunicationsChemistryPsychotherapistPsychologyVibration and Dynamic AnalysisStructural Analysis and OptimizationDynamics and Control of Mechanical Systems