Significant enhancement of comprehensive properties of SnBi solder through the addition of Cu@Ag core-shell particles
Shiqin Li, Qinghai Li, Huijun Cao, Xianhua Zheng, Zhihao Zhang
Topics & Concepts
Materials scienceEutectic systemSolderingThermal conductivityBrittlenessComposite materialMetallurgyElectrical resistivity and conductivityLamellar structureUltimate tensile strengthMicrostructureElectrical engineeringEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties