A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys
Chaoping You, Longfei Zeng, Rui Gao, Xuehui Zhang, Hang Wang
Topics & Concepts
Materials scienceMicrostructureUltimate tensile strengthAccumulative roll bondingCopperDuctility (Earth science)Composite materialElectrical resistivity and conductivityComposite numberAnnealing (glass)MetallurgyElongationConductivityElectrical conductorGrain sizeCreepPhysical chemistryElectrical engineeringEngineeringChemistryMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis