Microstructure evolution and mechanical properties of Sn-9Zn-2.5Bi-1.5In solder joints with aging treatment under various conditions
Shiliang Gong, Gaoqiang Chen, Songtao Qu, Xun Xu, Vichea Duk, Qingyu Shi, Gong Zhang
Topics & Concepts
Materials scienceMicrostructureSolderingComposite materialMetallurgyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis