Low-Inductance Double-Sided Cooling Power Module with Branched Lead Frame Terminals for EV Traction Inverter
Takeshi Tokuyama, Akira Mima, Yusuke takagi, Akira Matsushita
Abstract
We propose a new low-inductance power module structure for double-sided cooling. In the proposed structure, DC terminals are branched, and the positive and negative terminals are alternately arranged for magnetic field canceling. By arranging these terminals on the same plane and designing them to have the same thickness, these terminals can be pressed by a transfer molding die. Our proposed structure can reduce stray inductance and be applied to transfer molding, which ensures its reliability by resin encapsulation. This paper presents the experimental results of the proposed structure. We prove that the proposed structure can reduce inductance better than the conventional type.
Topics & Concepts
InductanceLead frameElectrical engineeringInverterTransfer moldingPower moduleMaterials scienceComputer sciencePower (physics)EngineeringPhysicsVoltageComposite materialSemiconductor deviceLayer (electronics)Quantum mechanicsMoldAdvanced DC-DC ConvertersElectromagnetic Compatibility and Noise SuppressionSilicon Carbide Semiconductor Technologies