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PCIe 5.0 Connector Distributed Physical-Based Circuit Model With Loading Resonances for Fast SI Diagnosis and Pathfinding

Yulin He, Kewei Song, Haonan Wu, Milton Feng

2024IEEE Transactions on Microwave Theory and Techniques11 citationsDOIOpen Access PDF

Abstract

We report on the development of a fast signal integrity (SI) diagnosis and pathfinding tool for a Peripheral Component Interconnect Express (PCIe) 5.0 connector based on the distributed physical-based transmission line (dPBTL) circuit model. Frequency-dependent loading resonances due to add-in card (AIC) and baseboard (BB) are identified via HFSS field simulation and analysis. The subcircuit models for ground-cavity (GC) and stub-effect resonances are established and matched well with the field simulated. The integrated dPBTL accurately predicts differential-mode performances and resonant crosstalk up to 64 GHz, speeds up simulation by <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$5000\times $ </tex-math></inline-formula>, and reduces data storage by <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$4.84\times 10^{6}$ </tex-math></inline-formula> compared with the traditional full-wave approach. Fast-guided and evaluated by 1-D dPBTL, design modifications reduce loading resonances and broadband dispersion, meeting PCIe 6.0 S-parameter requirements. Informed by dPBTL design, the 3-D pathfinding PCIe 6.0 connector demonstrates a 700% eye height (EH) enlargement and 150% eye width (EW) improvement at 64-GT/s non-return-to-zero (NRZ). Average 14% and 35% are improved in EH and EW for the three eyes at 64-GT/s (32-GBaud) PAM4. Furthermore, eye-openings at 128- and 144-GT/s PAM4 support further development toward PCIe 7.0 applications.

Topics & Concepts

PCI ExpressCable glandComputer sciencePrinted circuit boardElectronic engineeringOptoelectronicsElectrical engineeringEmbedded systemMaterials scienceEngineeringTelecommunicationsField-programmable gate arrayIntegrated Circuits and Semiconductor Failure AnalysisVLSI and Analog Circuit TestingSilicon and Solar Cell Technologies
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