New thermal packaging with a boiling-driven heat spreader for thermal management of the power electronics
Hyunmuk Lim, Seung M. You, Jungho Lee
Topics & Concepts
Heat spreaderHeat sinkMaterials scienceBoilingHeat transferThermal conductivityThermal resistanceHeat fluxThermalHeat pipeElectronicsMechanical engineeringThermal greaseComposite materialThermodynamicsElectrical engineeringEngineeringPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesThermal properties of materials