Effect of βSn grain orientations on the electromigration-induced evolution of voids in SAC305 BGA solder joints
Chuan Li, Hongyong Yuan, Zhaowu Ma, Xiaowei Cheng
Topics & Concepts
Materials scienceBall grid arrayElectromigrationSolderingMetallurgyComposite materialElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis3D IC and TSV technologies