Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging
Byungmin Ahn
Abstract
In the field of electronics packaging, Pb-bearing solder alloys are mostly used as robust interconnecting materials [...]
Topics & Concepts
MicroelectronicsInterconnectionSolderingElectronic packagingMaterials scienceIntegrated circuit packagingPackaging engineeringEngineering physicsManufacturing engineeringNanotechnologyEngineeringMetallurgyIntegrated circuitMechanical engineeringOptoelectronicsComposite materialTelecommunicationsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrodeposition and Electroless Coatings