Litcius/Paper detail

Structural, optical and electrical properties of copper chloride filled polyvinyl chloride/polystyrene blend and its antifungal properties against Aspergillus avenaceus and Aspergillus terreus

Doaa A. Nasrallah, M.A. Morsi, F. El-Sayed, Rabab A. Metwally

2020Composites Communications27 citationsDOI

Topics & Concepts

Materials sciencePolyvinyl chlorideAspergillus terreusComposite numberPolystyreneCopper chloridePolymerNuclear chemistryComposite materialCopperChemistryMetallurgyFood sciencePolymer Nanocomposite Synthesis and IrradiationConducting polymers and applicationsNanocomposite Films for Food Packaging
Structural, optical and electrical properties of copper chloride filled polyvinyl chloride/polystyrene blend and its antifungal properties against Aspergillus avenaceus and Aspergillus terreus | Litcius