Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering
Xin Fu Tan, Qinfen Gu, Michael Bermingham, Stuart D. McDonald, Kazuhiro Nogita
Topics & Concepts
Materials scienceIntermetallicSolderingNucleationMelting pointGrain boundaryPhase (matter)Growth rateMetallurgyMicrostructureFlip chipChemical engineeringComposite materialLayer (electronics)ThermodynamicsAlloyAdhesiveOrganic chemistryChemistryEngineeringMathematicsGeometryPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties