Material removal characterization during axial ultrasonic vibration grinding SiCp/Al composites with a single diamond grain
Jianhao Peng, Yu Yao, Zhipeng Xu, Xuebin Yao, Biao Zhao, Wenfeng Ding
Topics & Concepts
GrindingMaterials scienceComposite materialDiamondVibrationCharacterization (materials science)Ultrasonic sensorAcousticsNanotechnologyPhysicsAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization Techniques