Electrochemical behaviors of additives in high Cu(II) concentration solution for high-aspect-ratio through ceramic holes filling
Qing Wang, Yun Mou, Jiaxin Liu, Yang Peng, Mingxiang Chen
Topics & Concepts
Materials scienceElectrochemistryPEG ratioPlating (geology)Polyethylene glycolCeramicChemical engineeringElectroplatingMetallurgyComposite materialNuclear chemistryElectrodeLayer (electronics)ChemistryGeophysicsEconomicsEngineeringFinanceGeologyPhysical chemistryElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionAdvanced materials and composites