The internal modified layer structure of silicon carbide induced by ultrafast laser and its application in stealth dicing
Xiaozhu Xie, Tao Liu, Kaijun Lv, Yaoan Huang, Yajun Huang, Wei Hu, Jiangyou Long
Topics & Concepts
Wafer dicingWaferMaterials scienceSilicon carbideLaserLayer (electronics)Surface roughnessSurface finishComposite materialSiliconEnhanced Data Rates for GSM EvolutionCarbideOptoelectronicsOpticsPhysicsTelecommunicationsComputer scienceAdvanced Surface Polishing TechniquesLaser Material Processing TechniquesDiamond and Carbon-based Materials Research