Thermal Challenges for HPC 3DFabric<sup>TM</sup> Packages and Systems
Kathy Wei Yan, Po-Yao Lin, Sheng-Liang Kuo
Abstract
With HPC devices continue to scale up for higher power and higher power density, thermal dissipation management for IC packages are becoming an important issue. This paper presents the thermal solution evolution at package level and system level, that drives towards more advanced package TIM1 solution and liquid or immersion cooling solution. Thermal-aware device floorplan, package thermal solution and advanced system cooling solution are critical to enable HPC application
Topics & Concepts
Thermal management of electronic devices and systemsFloorplanComputer coolingThermalComputer scienceDissipationMaterials scienceNuclear engineeringEmbedded systemMechanical engineeringEngineeringPhysicsThermodynamics3D IC and TSV technologiesElectromagnetic Compatibility and Noise SuppressionVLSI and FPGA Design Techniques