From 2D to 3D: Postsynthetic Pillar Insertion in Electrically Conductive MOF
Ji Yong Choi, John E. Flood, Michael Stodolka, Hoai T. B. Pham, Jihye Park
Abstract
The emergence of 2D electrically conductive metal–organic frameworks (MOFs) has significantly expanded the scope of metal–organic framework applications from electrochemical energy storage to electronic devices. However, their potentials are not fully exploited due to limited accessibility to internal pores in stacked 2D structures. Herein we transform a 2D conjugated MOF into a 3D framework via postsynthetic pillar-ligand insertion. Cu-THQ was chosen due to its ability to adopt additional ligands at the axial positions at the copper nodes. Cu-THQ demonstrates that structural augmentation increases ion accessibility into internal pores, resulting in an increased gravimetric capacitance up to double that of the pristine counterpart. Beyond this, we believe that our findings can further be used to functionalize the existing 2D conductive MOFs to offer more opportunities in sensing, electronic, and energy-related applications by utilizing additional functions and increased accessibility from the pillars.