Litcius/Paper detail

Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering

Jingfei Yin, Qian Bai, Han Haitjema, Bi Zhang

2020Journal of Materials Processing Technology29 citationsDOIOpen Access PDF

Topics & Concepts

WaferMaterials scienceGrindingSiliconLayer (electronics)LaserMicroscopyScatteringOpticsOptoelectronicsOptical microscopeComposite materialScanning electron microscopePhysicsAdvanced Surface Polishing TechniquesLaser Material Processing TechniquesSurface Roughness and Optical Measurements
Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering | Litcius