Thermal neutron transmutation doping of GaN semiconductors
Richard Barber, Quang Nguyen, John D. Brockman, J.M. Gahl, Jae W. Kwon
Abstract
Abstract High quality Ge doping of GaN is demonstrated using primarily thermal neutrons for the first time. In this study, GaN was doped with Ge to concentrations from 10 16 Ge atoms/cm 3 to 10 18 Ge atoms/cm 3 . The doping concentrations were measured using gamma-ray spectroscopy and confirmed using SIMS analysis. The data from SIMS analysis also show consistent Ge doping concentration throughout the depth of the GaN wafers. After irradiation, the GaN was annealed in a nitrogen environment at 950 °C for 30 min. The neutron doping process turns out to produce spatially uniform doping throughout the whole volume of the GaN substrate.
Topics & Concepts
DopingMaterials scienceWaferGermaniumNeutronSemiconductorIrradiationSubstrate (aquarium)ImpurityNeutron temperatureAnalytical Chemistry (journal)OptoelectronicsSiliconChemistryNuclear physicsPhysicsChromatographyGeologyOrganic chemistryOceanographyGaN-based semiconductor devices and materialsGa2O3 and related materialsSemiconductor materials and devices