In-line imaging and recognition of flip chip fabrication defects by real-time photoacoustic remote sensing system
Jijing Chen, Kaixuan Ding, Yihan Pi, Shoujun Zhang, Jiao Li, Zhen Tian
Abstract
Microscopic defects in flip chips, originating from manufacturing, significantly affect performance and longevity. Post-fabrication sampling methods ensure product functionality but lack in-line defect monitoring to enhance chip yield and lifespan in real-time. This study introduces a photoacoustic remote sensing (PARS) system for in-line imaging and defect recognition during flip-chip fabrication. We first propose a real-time PARS imaging method based on continuous acquisition combined with parallel processing image reconstruction to achieve real-time imaging during the scanning of flip-chip samples, reducing reconstruction time from an average of approximately 1134 ms to 38 ms. Subsequently, we propose improved YOLOv7 with space-to-depth block (IYOLOv7-SPD), an enhanced deep learning defect recognition method, for accurate in-line recognition and localization of microscopic defects during the PARS real-time imaging process. The experimental results validate the viability of the proposed system for enhancing the lifespan and yield of flip-chip products in chip manufacturing facilities.