Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles
A. Yakymovych, Yu. Plevachuk, Ľubomír Orovčík, P. Švec
Topics & Concepts
IntermetallicSolderingMaterials scienceNanocompositeLayer (electronics)Solder pasteAlloyMetallurgyComposite materialNanochemistrySubstrate (aquarium)Morphology (biology)NanoparticleJoint (building)NanotechnologyGeologyEngineeringGeneticsOceanographyBiologyArchitectural engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties