High thermal conductivity and low dielectric polyimide nanocomposites using diamine-assisted mechanochemical exfoliation boron nitride and in-situ polymerization under pressure
Zhiyuan Peng, Qifan Guo, Ling Zhang, Chunzhong Li
Topics & Concepts
Materials scienceDielectricBoron nitrideNanocompositePolyimideThermal conductivityExfoliation jointComposite materialIn situ polymerizationSilsesquioxanePolymerizationPolymerNanotechnologyOptoelectronicsGrapheneLayer (electronics)Thermal properties of materialsDielectric materials and actuatorsThin-Film Transistor Technologies