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Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

Ming Li, Xiaoguang Guo, Siyang Dai, Song Yuan, Jianli Ma, Fumin Liu, Lemin Zhang, Dongming Guo, Ping Zhou

2022Materials Science in Semiconductor Processing36 citationsDOI

Topics & Concepts

Materials scienceMonocrystalline siliconScratchingMachiningGrindingMetallurgySiliconComposite materialAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationMetal and Thin Film Mechanics
Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon | Litcius