Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition
Shiran Ma, Linmei Yang, Jiyou Yang, Yawei Liang
Topics & Concepts
Materials scienceSolderingMicrostructureUltimate tensile strengthJoint (building)Electron backscatter diffractionComposite materialMetallurgyComposite numberNanoparticleGrain sizeScanning electron microscopeDislocationNanotechnologyArchitectural engineeringEngineeringElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis