The use of AFM in assessing the crack resistance of silicon wafers of various orientations
V. A. Lapitskaya, T. A. Kuznetsova, Anastasiya Khabarava, С. А. Чижик, С. М. Айзикович, Evgeniy V. Sadyrin, B. I. Mitrin, Weifu Sun
Topics & Concepts
NanoindentationWaferMaterials scienceIndentationSiliconComposite materialMicroelectromechanical systemsModulusIndentation hardnessAtomic force microscopyStress intensity factorFracture toughnessElastic modulusFracture mechanicsFracture (geology)OptoelectronicsNanotechnologyMicrostructureMetal and Thin Film MechanicsAdvanced Surface Polishing TechniquesForce Microscopy Techniques and Applications