Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC
Ren-Hao Song, Junqin Zhang, Zhanqi Zhu, Guangbao Shan, Yintang Yang
Topics & Concepts
InterconnectionDie (integrated circuit)InterposerReliability (semiconductor)Integrated circuitThree-dimensional integrated circuitChipComputer scienceEmbedded systemEngineeringElectronic engineeringElectrical engineeringLayer (electronics)Materials scienceComputer networkOperating systemQuantum mechanicsEtching (microfabrication)Power (physics)Composite materialPhysics3D IC and TSV technologiesThin-Film Transistor TechnologiesAdditive Manufacturing and 3D Printing Technologies