Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications
Honglei Chen, Xue-Mei Luo, Dong Wang, Peter Schaaf, Guangping Zhang
Topics & Concepts
Materials sciencePolyimideNanocrystalline materialComposite materialGrain boundaryCrackingCyclic stressLayer (electronics)NanotechnologyMicrostructureAdvanced Sensor and Energy Harvesting MaterialsElectronic Packaging and Soldering TechnologiesMechanical stress and fatigue analysis