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Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

A. M. El-Taher, Shoaib Azeem, A.A. Ibrahiem

2021Journal of Materials Science Materials in Electronics17 citationsDOI

Topics & Concepts

Materials scienceEutectic systemAlloySolderingSupercoolingMicroelectronicsDifferential scanning calorimetryRotating magnetic fieldEquiaxed crystalsMetallurgyDuctility (Earth science)Composite materialUltimate tensile strengthDissipationCreepThermodynamicsMagnetic fieldNanotechnologyQuantum mechanicsPhysicsElectronic Packaging and Soldering TechnologiesMetallic Glasses and Amorphous AlloysAluminum Alloy Microstructure Properties
Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field | Litcius