Effects of ultrasonic treatment on mechanical properties and microstructure evolution of the Cu/SAC305 solder joints
Xiaowu Hu, Xu Han, Wenjing Chen, Xiongxin Jiang
Topics & Concepts
Materials scienceSolderingUltrasonic sensorMicrostructureIntermetallicComposite materialShear strength (soil)UltrasoundJoint (building)MetallurgyAlloyStructural engineeringEnvironmental scienceSoil waterEngineeringPhysicsAcousticsSoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis