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CFD Approach for Thermal Management to Enhance the Reliability of IC Chips

Anant Sidhappa Kurhade, Govindrajan Murali, Venkateswara Rao T

2022International Journal of Engineering Trends and Technology43 citationsDOI

Topics & Concepts

Reliability (semiconductor)Reliability engineeringThermal management of electronic devices and systemsComputational fluid dynamicsComputer scienceMechanical engineeringEngineeringAerospace engineeringPhysicsThermodynamicsPower (physics)Electrostatic Discharge in ElectronicsSemiconductor materials and devicesElectronic Packaging and Soldering Technologies
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