Atomic level surface roughness of epoxy resin induced by novel chemical mechanical polishing with high material removal rate and its mechanisms elucidated using molecular dynamics simulations and density functional theory
Jiaxin Li, Zhenyu Zhang, Hongxiu Zhou, Feng Zhao, Xiuqing Liu, Wei Wen
Abstract
, and this conformation was the most stable. During adsorption, 0.012 eV of energy was transferred to dichloromethane from the small crosslinked molecules. Molecular dynamics simulations and density functional theory were used to perform these calculations. Dichloromethane relaxed the resin surface, speeding up the migration rate of chains and reducing their energy of breaking. The combined effect of mechanical shear force, compressive force and relaxation of swelling led to the breakage of C-N bonds with the lowest energy in the chains. The broken short chains were wrapped in dichloromethane, separating from the surface of the resin with the slurry flow. Our results provide new insights into acquiring an atomic level epoxy resin surface with soft-plastic, thermal softening and corrosion resistance characteristics.