3D printed epoxy composite microsandwich with high strength, toughness, and EMI shielding performances
Zhenyu Wang, Xingle Zhang, Changli Cheng, Xinyu Song, Chenxi Hua, Liyang Feng, Junyi Yang, Jing Jiang, Yu Liu
Topics & Concepts
Materials scienceElectromagnetic shieldingComposite materialEMIToughnessEpoxyComposite numberFracture toughnessElectromagnetic interferenceElectronic engineeringEngineeringElectromagnetic wave absorption materialsCellular and Composite StructuresAdvanced Antenna and Metasurface Technologies