Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
Jie Yang, Qingke Zhang, Zhenlun Song
Topics & Concepts
SolderingEutectic systemMaterials scienceMicrostructureIndentation hardnessMetallurgyToughnessFracture toughnessDuctility (Earth science)Reflow solderingComposite materialCreepElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy Properties