Alkyl-terminated PEG suppressors for copper electroplating and their hydrophilic and hydrophobic properties
Chuanyue Han, Yuehui Zhai, Yuanming Chen, Jiujuan Li, Wen‐Bin Cai, Zhiyou Zhou, Yan Hong, Chong Wang, Guoyun Zhou
Topics & Concepts
OverpotentialAlkylElectrochemistryPolarization (electrochemistry)CopperElectroplatingMaterials sciencePEG ratioChemical engineeringPolymer chemistryChemistryInorganic chemistryNanotechnologyOrganic chemistryPhysical chemistryMetallurgyElectrodeLayer (electronics)EngineeringFinanceEconomicsElectrodeposition and Electroless CoatingsMolecular Junctions and NanostructuresCorrosion Behavior and Inhibition