A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
Chongyang Cai, Jiefeng Xu, Huayan Wang, Seungbae Park
Topics & Concepts
Eutectic systemSolderingMaterials scienceTemperature cyclingSolder pasteBall grid arrayMetallurgyReliability (semiconductor)Printed circuit boardComposite materialAlloyThermalEngineeringElectrical engineeringPower (physics)PhysicsMeteorologyQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis