Low dislocation density AlN on sapphire prepared by double sputtering and annealing
Ding Wang, Kenjiro Uesugi, Shiyu Xiao, Kenji Norimatsu, Hideto Miyake
Abstract
AlN on sapphire with dislocation density of 10 7 cm -2 was prepared by double sputtering and annealing processes.Full width at half maximum values of X-ray rocking curve for ( ) 0002 and ( ) 1012 diffractions of the AlN films were measured to be 10-20 arcsec and 65-82 arcsec, respectively.Dislocations were characterized by plan-view and cross-sectional transmission electron microscopy, and the total dislocation density was estimated as 4.3 10 7 cm -2 .A polarity inversion layer was found between the two sputtered AlN layers, which increased the possibility of blocking dislocations stemming from the AlN/sapphire interface.
Topics & Concepts
SapphireMaterials scienceDislocationAnnealing (glass)SputteringTransmission electron microscopyCrystallographyOptoelectronicsOpticsComposite materialThin filmChemistryNanotechnologyPhysicsLaserGaN-based semiconductor devices and materialsMetal and Thin Film MechanicsAcoustic Wave Resonator Technologies