Multi-objective optimization of energy consumption, surface roughness, and material removal rate in diamond wire sawing for monocrystalline silicon wafer
Eyob Messele Sefene, Chao-Chang Arthur Chen
Topics & Concepts
WaferSurface roughnessMonocrystalline siliconEnergy consumptionMaterials scienceWire speedSurface finishMechanical engineeringDiamondSiliconProcess engineeringComposite materialMetallurgyEngineeringOptoelectronicsElectrical engineeringAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesTunneling and Rock Mechanics