Anchoring sulfur migration to mitigate Kirkendall voids in nano-twinned copper interconnections for robust and reliable packaging

Zicheng Sa, Shang Wang, He Zhang, Jiayun Feng, Haozhe Li, Jingxuan Ma, Xudong Liu, Qing Sun, Yanhong Tian

2025Journal of Material Science and Technology10 citationsDOI

Topics & Concepts

Kirkendall effectCopperMaterials scienceAnchoringSulfurMetallurgyNanotechnologyComposite materialStructural engineeringEngineeringCopper Interconnects and ReliabilityElectronic Packaging and Soldering Technologies3D IC and TSV technologies