Novel Ag-Cu foam sheet with multi-layer composite structure for high performance joining of SiC power chips
Changhao Yin, Kuxitaer Wumaeraili, Yu Zhang, Yongchao Wu, Jiahe Zhang, Wei Guo, Ying Zhu, Xiaoguo Song, Qiang Jia, Hongqiang Zhang
Topics & Concepts
Materials scienceMicrostructureComposite materialThermal shockJoint (building)SinteringShear strength (soil)Composite numberLayer (electronics)Service lifeGrain sizeShear (geology)Structural engineeringEnvironmental scienceSoil waterEngineeringSoil scienceNanoporous metals and alloysAluminum Alloys Composites PropertiesMetallic Glasses and Amorphous Alloys