Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations
Zezong Zhang, Wenjing Chen, Xiaowu Hu, Guangbin Yi, Bin Chen, Jue Wang, Lan Jiang, Xiongxin Jiang, Qinglin Li
Topics & Concepts
Materials scienceIntermetallicComposite materialSolderingShear strength (soil)Shear (geology)Grain sizeElectron backscatter diffractionMetallurgyMicrostructureAlloySoil scienceEnvironmental scienceSoil waterElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties