Enhancing oxidation resistance of Cu thin film through grain size reduction
Yan Fang, Yanqiao Wang, Yuren Bian, Y. Ngiam, Mingxin Huang
Topics & Concepts
Materials scienceKirkendall effectGrain boundaryCopperGrain sizeGrain boundary diffusion coefficientChemical engineeringDiffusionNanoscopic scaleThin filmVoid (composites)Diffusion barrierOxygenTransmission electron microscopyConductivityMetallurgyElectrical resistance and conductanceVolume fractionComposite materialRedoxNanotechnologyGrain growthCopper interconnectSurface diffusionAluminiumChemical physicsElectrical conductorElectrical resistivity and conductivityLattice diffusion coefficientOxideStrengthening mechanisms of materialsMetalZnO doping and propertiesCopper-based nanomaterials and applicationsSemiconductor materials and devices