Thermal stress reduction strategy for high-temperature power electronics with Ag sintering
Hui Ren, Guisheng Zou, Qiang Jia, Zhongyang Deng, Chengjie Du, Wengan Wang, Lei Liu
Topics & Concepts
Materials scienceJunction temperatureSinteringPower moduleComposite materialStress (linguistics)Thermal expansionRibbonTemperature cyclingElectronic packagingElectronicsDie (integrated circuit)Finite element methodPower electronicsThermalPower (physics)Electrical engineeringStructural engineeringEngineeringPhysicsPhilosophyQuantum mechanicsMeteorologyLinguisticsNanotechnologyElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies3D IC and TSV technologies