Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air

Xiaocun Wang, Zhaoqiang Zhang, Yunya Feng, Fei Xiao

2021Journal of Materials Science Materials in Electronics28 citationsDOI

Topics & Concepts

CopperMaterials scienceNanoparticleMetallurgyChemical engineeringCopper oxideComposite materialNanotechnologyEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability