Litcius/Paper detail

A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials

Eyob Messele Sefene, Chao‐Chang A. Chen, Yueh-Hsun Tsai

2024Journal of Manufacturing Processes40 citationsDOI

Topics & Concepts

Materials scienceDiamondBrittlenessProcess (computing)Composite materialEngineering physicsForensic engineeringMechanical engineeringNanotechnologyEngineering drawingEngineeringComputer scienceOperating systemAdvanced Surface Polishing TechniquesTunneling and Rock MechanicsDiamond and Carbon-based Materials Research