Development of lead free solder for electronic components based on thermal analysis
Niranjan Kumar, Ambrish Maurya
Topics & Concepts
SolderingIntermetallicMelting temperatureMaterials scienceMetallurgyLead (geology)CadmiumComposite materialAlloyGeologyGeomorphologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties