Litcius/Paper detail

Intermetallic growth activation energy improvement in graphene doped Sn-3.5Ag solder

Ramani Mayappan, Amirah Salleh

2021Materials Letters11 citationsDOI

Topics & Concepts

IntermetallicSolderingMaterials scienceMetallurgyLayer (electronics)Substrate (aquarium)GrapheneCopperComposite materialNanotechnologyAlloyGeologyOceanographyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesInjection Molding Process and Properties