Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Topics & Concepts
WavinessFlatness (cosmology)VibrationWaferGrindingMachiningSurface roughnessMaterials scienceSurface finishMechanical engineeringRotational speedAcousticsEngineeringPhysicsComposite materialOptoelectronicsQuantum mechanicsCosmologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Measurement and Metrology Techniques