Reliability Simulation and Life Prediction of TSV Under a Thermoelectric Coupling Field in a 3D Integrated Circuit
Hao Ni, Liang He, Hua Chen, Xiaofei Jia
Topics & Concepts
Materials scienceBenzocyclobuteneReliability (semiconductor)Through-silicon viaCoaxialInterconnectionCoupling (piping)DielectricComposite materialCarbon nanotubeElectronic engineeringOptoelectronicsSiliconElectrical engineeringEngineeringTelecommunicationsPower (physics)Quantum mechanicsPhysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies