Microstructure and residual stress gradient evolution mechanism of electronic copper strip for lead frame
Binbin Wang, Yahui Liu, Qianqian Zhu, Hailong Wang, Qingxiang Chen, Jiang Feng, Yanjun Zhou, Haitao Liu, Qi Li, Kexing Song
Topics & Concepts
Residual stressMicrostructureLead frameCopperMaterials scienceMechanism (biology)MetallurgyStress (linguistics)Lead (geology)Composite materialGeologyPhysicsLinguisticsLayer (electronics)GeomorphologySemiconductor devicePhilosophyQuantum mechanicsWelding Techniques and Residual StressesMicrostructure and Mechanical Properties of SteelsAdvanced Welding Techniques Analysis