The self-healing of Kirkendall voids on the interface between Sn and (1 1 1) oriented nanotwinned Cu under thermal aging
Shiqi Zhou, Yubo Zhang, Li‐Yin Gao, Zhe Li, Zhi‐Quan Liu
Topics & Concepts
Kirkendall effectIntermetallicMaterials scienceCrystalliteThermal diffusivityCopperLayer (electronics)MetallurgyWettingSolderingComposite materialAlloyPhysicsQuantum mechanicsNanomaterials and Printing TechnologiesCopper Interconnects and ReliabilityNanoporous metals and alloys